High quality material

High quality material

High quality material

Thermal paste ideal for optimizing thermal conductivity | Thermal conductivity 8.5 W / mk | Thermal resistance 0.0129 K / W | Electrical conductivity * 0 pS / m | Content: 7.8g

High quality thermal pads as an alternative to thermal paste | Provides maximum thermal conductivity | Pads are reusable and do not dry out | Dimensions: 25 × 25 × 0.2 mm

High quality thermal pads as an alternative to thermal paste | Provides maximum thermal conductivity | Pads are reusable and do not dry out | Dimensions: 31 × 25 × 0.2 mm

High quality thermal pads as an alternative to thermal paste | Provides maximum thermal conductivity | Pads are reusable and do not dry out | Dimensions: 38 × 38 × 0.2 mm

Thermal Conductivity 11.8 W/mK | Resistance termica 0.0076 K/W | Viscosity 140 – 190 Pas | The color is light gray | Goes best with thermal grizzly attachment or with Applicator Brush, Spatula, screenprinted or pad printing

Thermal paste ideal for optimizing thermal conductivity | Thermal conductivity: 11.8 W / mk | Thermal resistance: 0.0076 K / W | Electrical conductivity: * 0 pS / m | Content: 7.8g

Thermal Grizzly Kryonaut Thermal Paste was specially developed for extremely demanding applications and the most demanding of Overlocking community | Extrem high Thermal Conductivity: 12.5 wm / k | 1.0 grams are sufficient for several applications | Easy cleaning of the CPU with the enclosed cleaning pads | Quick application of the new heat conducting paste with the enclosed spatula

· thermal conductivity: 12.5 W/ m · K | Viscosity: 120 to 170 pas | ・ heat resistant Temperature: -200 ° C to 350 ° C | ・ color: light Gray | ・ volume: 3 ml (11.1 g)

Thermal paste ideal for optimizing thermal conductivity | Thermal conductivity: 12.5 W / mk | Thermal resistance: 0.0032 K / W | Electrical conductivity: * 0 pS / m | Content: 1g

Thermal paste ideal for optimizing thermal conductivity | Thermal conductivity: 12.5 W / mk | Thermal resistance: 0.0032 K / W | Electrical conductivity: * 0 pS / m | Content: 5.55g

High-performance thermal pads | High thermal conductivity | High compressibility | Electrically insulating | Dimensions: 100 × 100 × 1.0 mm

High-performance thermal pads | High thermal conductivity | High compressibility | Electrically insulating | Dimensions: 120 × 20 × 0.5 mm

High-performance thermal pads | High thermal conductivity | High compressibility | Electrically insulating | Dimensions: 120 × 20 × 1.0 mm

High-performance thermal pads | High thermal conductivity | High compressibility | Electrically insulating | Dimensions: 30 × 30 × 0.5 mm

Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks | Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment | The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat | Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components | Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate

DER8AUER DELIDDING TOOL - Compatible with 12th/13th Intel Core generation, developed by Roman "der8auer" Hartung | DURABILITY AND AESTHETICS - Made from black and red anodized aluminum | REMOVES THE HEATSPREADER - Enables more ecient "Direct Die" cooling, resulting in temperature reduction by 10-20°C | IMPROVED COOLING PERFORMANCE - Facilitates better heat dissipation, enhancing the overall cooling eciency of the CPU | EFFORTLESS INSTALLATION - Designed for easy and hassle-free operation, making the delidding process straightforward and efficient

OPTIMAL PRESSURE & PROTECTION - Provides optimal contact pressure for AMD Ryzen 7000 CPUs and protects the exposed components of the CPU with a silicone foam inlay | REPLACES THE SAM - Encloses the heatspreader and replaces the Standard Attachment Mechanism (SAM) of the mainboard | HIGH QUALITY MATERIAL - Made of anodized aluminium, ensures durability and stability | EVEN PRESSURE - Precision-milled inner contour provides optimal contact pressure through ideal contact points for better hardware detection | EASY MOUNTING & COMPATIBILITY - Clearly marked for correct alignment and suitable for Thermal Grizzly AM5 backplates

Delidding tool for AMD Ryzen 7000 CPUs, developed by Roman "der8auer" Hartung | Made from black and red anodized aluminum for durability and aesthetics | Ideal for soldered Ryzen 7000 processors, enables better heat transfer using liquid metal | Compatible with AM5 platform, enhances cooling performance despite thicker and smaller heatspreaders compared to AM4 | Removes the heatspreader for more efficient "Direct Die" cooling, lowering temperatures by 18-36°F

High Thermal Conductivity | High Compressibility | Provides Electrical Insulation

Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks | Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment | The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat | Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components | Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate

Compatible not only with computers or laptops, but also with PS3, PS4 or PS5 as well as Xbox 360, One and Series X consoles; Great for dissipating heat from Macbooks | Created for office or home computers and gaming computers, as well as for those users who require maximum turnover from the equipment | The thermal conductive pad is ideally suited between the heat sink and the heating element; Thanks to its unique composition, which consists of ceramic silicone and nano-aluminum oxide, it dissipates significant amounts of heat | Thermal padding is characterized by a flexible structure and very high heat conductivity; It compensates for even the smallest gaps between components | Used in places where it is not possible to use thermal paste, e.g. large air gap or uneven substrate