Material: 40mm heat sink anodized aluminum ; Color: Black | With excellent performance thermal conductive double sided tape | Can be applied for passive cooling of 3D printers stepper motor, ,rtx 3080, rtx 3090 backplate, NEMA 17, TEC1-12706 Thermoelectric Peltier Cooler, ender 3c Motors and android auto MA1 device and car's USB devices e,tc. | Dimension: 40x40x11mm (L*W*H) / 1.57 x 1.57 x 0.43 inch | Package: Heat sink x 4 pieces; Weight: 0.63 oz / 18 gr per pc

1. Improved version August 2023, 40mm anodized aluminum heat sinks, Flatter base plate and tick enough base material. | 2. Includes 4 pieces 40mm heatsink for heat dissipation device, great function for heat dissipation reduces CPU and LAN. | 3. Dimension: 1.57"x1.57"x0.79" (L*W*T) 40mmx40mmx20mm; Unit weight: 1.45 oz / 41 gram per piece. | 4. This 40mm heatsink kit is suitable for a variety of cooling applications such as 3D printer stepper motor NEMA17, PC chipset, power IC, power electric device, TEC1-12706 Thermoelectric module, LED light devices etc. | 5. Thermal conductive glue adhesive is the excellent partner to install the heat sink (gel is not included in the package)

Size: 80 x 80 x 27 mm /3.15 x 3.15 x 1 inch (L*W*H) | Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc | Weight : 7.4 oz ; Base board thickness:6 mm ; Fins board thickness:0.8mm; Fins:26Pcs | Use heatsink adhesive glue to install heatsink (Glue is not included) | For bulk purchasing to get better pricing and discounts, contact the seller of this product model as soon as possible

Product Name : Cooling 11 Fin;Material : Aluminium | Weight : 101g,Base board thickness:4.2mm,pin board thickness:1.3mm(1.8mm for two pin boards outside) | Size : 100mm x 40mm x 20mm / 3.9" x 1.6" x 0.8"(L*W*H) | Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc | Package Content : 2 x Heatsink

2 Pcs 50x25x10mm Black Anodized Heat Sink With Pre Thermal Conductive Tape | Size: 50mmx25mmx10mm/ 2 x 1 x 0.4 Inch (L*W*H) | Can be cooler for PCB Device LM2596 2577 2587 | Can be used for cooling CPU, GPU, development boards such as raspberry pi | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible

Material: Aluminium; Color: Black ; Fins : 8Pcs | Size: 100 x 25 x 10mm/4 x 18 x 0.4inch(L x W x H) with Pre Thermal Conductive Tape | Designed to maximize its surface area in contact with the cool air.Reduce the risk of LED light Or PCB failure due to overheating | Can be used for M.2 22110 SSD ,LED, Power IC, Power Amplifier,and Transistors etc | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible

2 Pcs Black Anodized Heat Sink with Pre-applied thermal conductive adhesive tape | Size: 70mmx25mmx10mm/ 2.75 x 1 x 0.4 inch (L*W*H) | Can be use for NVME M.2 SSD 2280 for efficient heat dissipation Can be used for cooling PCB,CPU, GPU, development boards such as raspberry pi | Can be used for cooling PCB,CPU, GPU, Can be applied for passive cooling of Water cooling modules, 3D printers stepper motor, NEMA 17, TEC1-12706, TEC1-12710 Thermoelectric Peltier Cooler, development boards such as raspberry pi | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible.

Made of high quality Aluminum, good thermal conductivity | Weight : 310g,Base board thickness:4.3mm, Fins board thickness:2mm | The maximum surface area design is in contact with the cooling air, thereby reducing the risk of hardware failure and power loss due to overheating, thereby improving safety | Widely used in computers, power transistors, FETs, ICs, power amplifiers, voltage regulators, MOSFETs, SCRs, etc | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible

Reduce the risk of hardware failure due to overheating. | Heatsink Size: 3.94" x2.71" x 1.41" /100 mm x 69mmx 36mm. | Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. | Maximize surface area Designed in contact with the cooling air. The 27pcs fins increase the area of the board and thus provide for greater heat transfer | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible.

Reduce the risk of hardware failure due to overheating. | Heatsink Size: 4.72" x2.71" x 1.41" /120mm x 69mmx 36mm. | Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. | Maximize surface area Designed in contact with the cooling air. The 27pcs fins increase the area of the board and thus provide for greater heat transfer | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible.

Reduce the risk of hardware failure due to overheating. | Heatsink Size: 5.9" x2.71" x 1.41" / 150mm x 69mmx 36mm. | Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. | Maximize surface area Designed in contact with the cooling air. The 27pcs fins increase the area of the board and thus provide for greater heat transfer | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible.

Reduce the risk of hardware failure due to overheating. | Heatsink Size: 2.71" x2.71" x 1.41" /69 mm x 69mmx 36mm (L*W*H) | Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. | Maximize surface area Designed in contact with the cooling air. The 27pcs fins increase the area of the board and thus provide for greater heat transfer | For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible.

Made of high quality Aluminum, good thermal conductivity | Weight : 988g,Base board thickness:3.1mm, Fins board thickness:2.5mm | Reduce the risk of hardware failure due to overheating | Maximize surface area Designed in contact with the cooling air. The 30 pcs fins increase the area of the board and thus provide for greater heat transfer | Specially designed for high power household LED light or fish tank LED devices, etc

✔Size: 2.8 inch x 0.9 inch x 0.1inch ;Materials: Aluminium alloy oxidation surface treatment | ✔5°C - 15°C Cooling Effect: Groove design, greatly increase the heat dissipation area. Cool your SSD to a safe temp to avoid overheating and throttling, improving the performance of your computer | ✔Compatible with: Universally fit for laptops and desktop computers. Supports NGFF PCIe NVMe M.2 SSD. Perfectly fit for Samsung 850 EVO, 860 EVO, 960 EVO, 970 EVO, 950 PRO, 960 PRO, 970 PRO, etc. ✔Unique Nano Silicone Thermal Pad: Soft and good ductility | ✔Unique Nano Silicone Thermal Pad: Soft and good ductility, compatible with uneven surfaces. Low viscosity, no damage to the M.2 SSD warranty label | ✔Warranty - 6 months warranty, If you're not satisfied with our products, just give us an email, We will give you a full refund,Or give you a new one